The iPhone 6s and 6s Plus are still fresh off the Apple gates but talks of its successor, iPhone 7, have already surfaced online. The latest word is that the next generation iPhone will finally have Intel inside.

Apple Inc. has just taken the veil off its latest iPhone, the 6s and 6s Plus, and it was a success, with New York Times reporting that its 13 million units sold during its first weekend is a new record for first weekend sales. This proves just how popular the Cupertino-based company's flagship phone is getting more and more popular every year. It is therefore no surprise that people are already starting to talk about the iPhone 7. The latest rumour attached to the up and coming phone is that it will bear the new Intel modem chip.

Says VentureBeat, Intel will be outfitting the rumoured iPhone 7 with the 7360 LTE modem chip. Furthermore, a thousand employees are now working on making that a possibility.

The same publication also hinted that it is possible that not all new iPhones will have Intel inside. The tech giant might still opt to dual source between Intel and its current chipset, Qualcomm. It also mentioned that no official contract had been drawn but will depend greatly on how Intel's current project works out.

"This is a must-win for Intel," the source says, pointing out that securing the iPhone will surely secure the company's place as well in the mobile chip provider slate. That field is currently being dominated by Qualcomm.

Recently, another rumour about the iPhone 7 resurfaced with a new patent filed by Apple Inc. It hints that future iPhones just might utilise Liquidmetal for the fastener hook and loop design. The iPhone 6s and 6s Plus currently uses the 7000 Series aluminium, which is already a remarkable jump from the iPhone's previous design.

Stay tuned for updates on the iPhone 7.